Publication Type:Conference Paper
Source:Integrated Ferroelectrics, Volume 52, p.19-31 (2003)
Keywords:Capacitors, Differential thermal analysis, Electrical characteristics, electrodes, Epitaxial growth, Fatigue endurance, Low temperature effects, Low-temperature fabrication, pyrolysis, Silicon wafers, Sol-gels, thin films
Epitaxial and random-oriented Pb(Zr,Ti)O 3 (PZT) films were fabricated at 450-550°C on SrRuO 3 (SRO)/SrTiO 3/Si and SRO/amorphous Ti-Al layer-Si substrates, respectively, using a modified sol-gel process. For comparison, polycrystalline PZT films were also prepared on Pt-Si substrates using the same method. Thermogravimetric and differential thermal analysis (TG-DTA) of the modified sol-gel solution indicated that the solution began crystallization below 400°C. Both SRO/epitaxial PZT/SRO and SRO/random-oriented PZT/SRO capacitors processed at the same temperature had similar polarization values, and all the SRO/PZT/SRO capacitors processed at 450-550°C exhibited the favorable electrical characteristics including high polarization, high resistivity, small pulse width dependence, and good fatigue endurance. While the Pt/PZT/Pt capacitors processed at 450°C showed considerably low polarization compared to the SRO/PZT/SRO capacitors processed at the same temperature. High-quality SRO/PZT/SRO capacitors processed at low temperature have a bright prospect of fabrication of potential Si devices integrated PZT capacitors without thermal degradation.
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